手机开发与设计流程详解

《手机开发与设计流程详解》由会员分享，可在线阅读，更多相关《手机开发与设计流程详解（48页珍藏版）》请在装配图网上搜索。

1、Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fünfte Ebene,,*,Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fünfte Ebene,,*,EP,,Heading Level

2、One,First line,Second line,Third line,Fourth line,Fifth line,,,*,BenQ Confidential (yyyy/mm/dd),,2005, BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,First

3、line,Second line,Third line,Fourth line,Fifth line,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,STRICTLY CONFIDENTIAL,Click to edit Master title style,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,BenQ,Confidential (2005/07/01),,2005, BenQ Corporation,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,B

4、enQ,Confidential (2005/07/01),,2005, BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,,,*,BenQ Confidential (03/01/2006),,2006, BenQ Corporation,,Click to edit Master title style,First line,Second line,Third line,Fourth line,Fifth line,,,*,BenQ Confidential (03/01/2006),,

5、2006, BenQ Corporation,,Click to edit Master title style,Heading Level One,First line,Second line,Third line,Fourth line,Fifth line,,,*,Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fünfte Ebene,,,按一下以編輯母片標題樣式,按一下以編輯母片,第二

6、層,第三層,第四層,第五層,,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,,手機產,品,品設計,與,與開發,,明基電,通,通,移動通,[,訊事業,群,群,專,專案管,理,理部,產品經,理,理,邱珮瑜,PollyChiu,2006/12/26,Topic,個人簡,介,介,明基,BenQ,簡介,產品開,發,發流程,手機開,發,發功能,區,區塊,手機系,統,統演進,3G,介紹,手機功,能,能發展,趨,趨勢,無線通,信,信發展,趨,趨勢,,,個人簡,介,介,個人簡,介,介,2000,年畢業,於,於中山,大,大學物,理,理研究,所,所,2001.04~2006.03:,明

7、基儲,存,存事業,部,部研發,處,處研發,部,部,Team LeaderofWriteStrategyTeam/ Firmware R&D,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40x,48x)drivedevelopment,團隊發,表,表世界,第,第一的,4x,8x, DL,16xDVD,燒錄機,IEEE,論文發,表,表,發表,4,篇專利,2006.03~2006.12:,明基移,動,動通訊,事,事業群,專,專案管,理,理部,技術產,品,品經理,-,目前負,責,責,3.5G HSDPA featurephoneproj

8、ect,明基,BenQ,簡介,-,享受快,樂,樂科技,數位時,尚,尚品牌,3C,數位整,合,合國,際,際級設,計,計實力,1984,年成立,企業願,景,景,:,傳達資,訊,訊生活,的,的真善,美,美,1996,年股票,在,在台灣,上,上市,2001,年,BenQ,品牌誕,生,生,2005,年營收,:,明基電,通,通,:,新台幣,1,623,億元,明基集,團,團,:,新台幣,3,979,億元,全球員,工,工人數,(2006/10),明基電,通,通,: 13,000+,人,明基集,團,團,: 68,000+,人,「量做,精,精品」,:,量身訂,做,做讓消,費,費者生,活,活,充滿樂,趣,趣的網,

9、絡,絡時尚,產,產品,獨特,3C,產品組,合,合：將,數,數位產,品,品整合,成,成符合,未,未來消,費,費者生,活,活型態,的,的數位,中,中樞,一,一,筆記型,電,電腦、,手,手機、,數,數位電,視,視,享受快,樂,樂科技,之,之企業,化企業,願,願景為,品,品牌使,命,命,,1992,2002,明基集,團,團企業,願,願景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,,C

10、orp.,單位,:,億元,(,新台幣,),,,,,,,Phase1,,1984-1991,OEM,,,,,,強大的,生產製,造,造能力,,,,從製造,代,代工到,深,深耕技,術,術與設,計,計之品,牌,牌,Phase2,,1991-2001,From OEMtoODM,,,,,,多元化,的,的技術,投,投資,“水平,整,整合,+,專業分,工,工”,,,Phase3,,2001-2006,From ODMtoBranded Business,,,,,數位時,尚,尚品牌,3C,數位整,合,合,國際級,設,設計實,力,力,單位,:,億元,(,新台幣,),三大事,業,業群,明基電,通,通,移動通,信,

11、信,事業群,(MCG),數位媒,體,體,事業群,(DMG),整合製,造,造服務,事業群,(IMS),洞悉數,位,位市場,掌,掌,握,握絕對,優,優勢,獨特,5C,策略,強,強化,競,競爭優,勢,勢,電子商,品,品整合,趨,趨勢贏,家,家,Computing,資訊產,品,品,個人電,腦,腦,,,液晶顯,示,示器,,,電腦週,邊,邊,,ConsumerElectronics,數位媒,體,體產品,數位投,影,影機,,,液晶電,視,視,,,個人無,線,線影音,,,數位相,機,機,,,車用顯,示,示器,MobileCommunications,移動通信產,品,品,行動電話,產品開發流,程,程,產品開發流

12、,程,程,Proposal,構想階段,Plan,評估規劃階,段,段,Design,設計階段,Execute,研發執行階,段,段,Massproduction,生產階段,Close,結束階段,,,,,,C System,,C1,Planning,Phase,,,C2,R&D Design,Phase,,,C3,Lab Pilot,Run Phase,,,C4,ENG Pilot,Run Phase,,,C5,PD Pilot,Run Phase,,Mass,Production,Phase,,,C6,,C0,Proposal,Phase,,,Planning-PM,Manufacture,-Fa

13、ctory,Design-RD,,,Product definition,Feasibility analysis,ID initiation,Organize Project team member,Project schedule,HW/SWdesign,HW/SWdesign lock down,HW/SWdesign approved,Verification ofProductmaturity verification,Productionlinesetup,Verification ofproduction line maturity/stability,Product desig

14、nfinalized,Massproduction,DVT Phase,MVT Phase,QVT Phase,,,,DVT :Design VerificationTesting,MVT:Manufacture VerificationTesting,QVT :Quality Verification Testing,,,,,,,,LPR:LaboratoryPilot Run,EPR:Engineering Pilot Run,PPR:ProductionPilot Run,MP: Mass Production,Mobile development function Introducti

15、on,Mobile development function,外觀設計,(ID),Industry Design,機構設計,(MD),Material Design,硬體設計,(HW)HardWare,BB (Base Band,基頻,),RF (RadioFrequency,射頻,),Antenna (,天線,),軟體設計,(SW)SoftWare,MMI (Man Machine Interface,人機介面,),Protocol,Driver,FunctionalArchitecture of Mobile Today,Feature List-HW,[Camera ],Sony2.0

16、Mega PixelCMOSAutoFocuscamera,[Strobe],LED flashlight,[Display],AUO 2.0” AMOLED176x220 Pixels, 262K colors,[Memory],NOR Flash:128Mbit,PSRAM: 64Mbit,NAND:256Mbit,SDRAM: 128Mbit,[ExternalMemory],T-Flash,[I/O],DC Jack ,10 pin I/O,[Connectivity],USB1.1 , Bluetooth,ID,Vol.Up /Vol.Down,2 SegmentShutter Ke

17、y,,,ModeSwitch Key,,10 Pin I/O,,DC Jack,,,Microphone,Receiver,,T-Flash Card,,MD :Appearancetreatmentdescription,A,鋁板陽極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,,Q,噴漆,Exploded drawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14

18、,17,16,Frontcaseassy.,Keypad assy.,Mainlens,Joystick cap,OLEDmodule,Receiver,Keypad FPC,MainPCB assy.,DSC module,DSC FPC,DSC holder,Speaker,Vibrator,Rearcaseassy.,Antenna cover,Battery cover.,Battery pack.,Placementdescription - I,Shieldingcase1 -BB,Shieldingcase2 -BB,T-flash connector,(push-pushtyp

19、e),Pogopin (for ESD),Back-up battery,(Capacitor),30pinBTBConn.,(forDSC module),Joystick,(Mitsumi),SMT-type MIC,Placementdescription - II,I/O connector,Battery connector,Modeswitch,BT antennaswitch,DC jack,Antenna connector,Antenna switch,Side-key (Vol-key),RF shielding case,10 pin Conn.,(Spk.andflas

20、h),LCM connector,BB shielding case,SIM connector,Key FPC connector,HW Block Diagram-2G,,Placement(TopSide),,Antenna,RF Area,,10 Pin I/O,Battery Connector,,,,IOTA,SIM Connector,G2,3 Combo,Memory,,,,,LCDMConnector,,Keypad Connector,,BT Area,,DC Jack,Placement(Bottom Side),AudioCODEC,,,MMP,MIC.,,,T Fla

21、sh Connector,,OLEDLimitArea,,LevelShifter,Camera Connector,,,Receiver,,Charging IC,PowerIC,,Antenna,SW FeatureReview,Band,Tri-band GSM/GPRS 900/1800/1900, GPRS Class 10,Tri-band GSM/GPRS 850/1800/1900, GPRS Class 10,Speech Codec,FR/EFR/HF/AMR,Embedded DSC,2.0 Mega Pixel CMOS sensor with Auto Focus +

22、 LED flash light,Memory,RSS 3 combo: NOR flash: 128Mb, Pseudo SRAM: 64Mb, Super-AND: 256Mb, SDRAM: SH-Mobile J2 embedded 128Mb,Connectivity,USB 1.1 (MSC, CDC, Pict-Bridge), Bluetooth (A2DP, HS/HF, BIP, OPP, DUN),Java,MIDP 2.0, CLDC1.1, JTWI,MP3, Melody,MP3/AAC(3D, EQ)/AAC+, SW-MIDI,Voice recording,,

23、AMR,Video recording/playing,,MP4, 3GP, H.263,DRM,OMA DRM 1.0,SW,Architecture-2G,,Tool,MMI,XPI (Extend ProgrammingInterface),Layer-1 /Driver,Service,Display,Input,Menu,PPF,…,AP,Camera,MP3,PIM,Tool,…,Protocol,CC,WAP,STK,Java,…,Message,SMS,EMS,MMS,Email,…,PS (Protocol Stack),OS,,,,,,手機系統演,進,進,3G Evolut

24、ion Overview,Analog,cdmaOne,[US],GSM [Europe],TDMA[US],PDC [JP],GPRS,EDGE,WCDMA,(UMTS, ULTRA FDD),HSDPA,cdma2000,cdma2000,(1xEVDO),cdma2000,(1xEVDV),TD-SCDMA,[China],1G,2G,2.5G,3G,3.5G,3G introduction,,,RF chipset,BB chipset,,PowerMgmtIC,3G MobileHW,Sirius BREW-3G,,,,,,Applications,Device driver,Ser

25、vices,,BREWOEM,,BREW,Extensions,,,BREW,,,,3G,手機單晶片,趨,趨勢,多模式應用,WEDGE,晶片,( WCDMA+EDGE),支援,WCDMA,、,EDGE,、,GPRS,、,GSM,和,HSDPA,標準,可以在,2G,和,3G,網路間切換,（,（,roaming,）,以,CMOS,製程應用,,,達到低成本,減,減少零組件,數,數、縮小尺,寸,寸、降低功,耗,耗，及提高,效,效能等,3G -->3.5G,HSDPA,網路陸續開,通,通,3G,升級到,3.5G,，不需再進,行,行基地台建,設,設，只需軟,體,體升級,3.5G,網路的下載,傳,傳輸速率已

26、,達,達,3.6Mbps(,比,3G,快,9,倍,,,甚至高於一,般,般家用的,2MADSL),2010,年預計行動數據服,務,務將會超越行動語音服,務,務，為手機系,統,統業者最重,要,要的收入來,源,源,預計全球,3.5G,用戶數將從,250,萬個,(2006,年,),，成長到,3,億個,(2011,年,),台灣業者,中華電信,:,採諾基亞的,系,系統,,,只開通支援,1.8Mbps,的,HSDPA,網路服務,遠傳電信,:,採易利信的,系,系統,,,推廣傳輸速,率,率高達,3.6Mbps,的,HSDPA,網路,支援,3.6Mbps,的手機尚未,到,到位，只能,以,以,3.5G,數據網卡先,

27、行,行,困難,–,2007,年會大幅改,善,善,網路涵蓋率,不,不足,3.5G,手機選擇少,,,價格高,手機功能發,展,展趨勢,-,高整合化,重外觀設計,個人化,多媒體,多用途,手機功能發,展,展趨勢,-,整合通訊,(Voice),，資訊,(Data),，傳播,(Video),和無線,(Wireless),現有功能,Mobile/Music/Video/Camera/Recorder/Game,Storage Memory/FM radio/Application/Brower/High data rate/Connectivity: E-mail,BT,USB,IrDA/Light/Indi

28、cator/ Voice recognition,GPS/A-GPS->,定位導航,/LBS,位置資訊服,務,務（,Location BasedServices,）,TV-Out,2D Bar code/QRCode,新功能發展,數位電視,DVB-H/,廣播,Finger Printer,電子錢包,:NFC,近距離無線,傳,傳輸（,NearFieldCommunication,NFC,）,Projector,,手機投影,無線通信發,展,展趨勢,無線通信發,展,展趨勢,FunctionalArchitecture of Mobile Tomorrow,FMC (Fixed-Mobile Conv

29、ergence),固網行動聚,合,合,固網和行動,網,網融合,: FMC,（,Fixed-Mobile Convergence)-,無縫隙不間,斷,斷的通訊品,質,質,由各種裝置,、,、服務、網,路,路，以及技,術,術所融合而,成,成,What’s IMS?,What’s IMS?,UMA-UnlicensedMobile Access,提出一套解,決,決方案，讓,使,使用授權頻,段,段的,GSM,和,GPRS,和使用無需,授,授權頻段的,Bluetooth,和,802.11,彼此間能夠,互,互相漫遊,可用單一手,機,機享受雙網,合,合一的優勢,，,，甚至兼具,節,節省話費的,好,好處。,UMA,（,UnlicensedMobile Access,）,對用戶來說,，,，採用,UMA,的技術後，,在,在手機網路,和,和,WiFi,或,Bluetooth,網路之間的,切,切換是由系,統,統來完成的,，,，用戶一點,感,感覺都沒有,Question?,